Key-note presentations will be given by internationally recognised experts from both academia and industry. The topics range from fundamental principles to simulation/modelling of processes, plasma sources, and various applications. The programme is:
Tuesday - 9th OF APRIL
Time | Title | Presenter | Affiliation |
09:00 | Registration with coffee/tea | ||
09:30 | Opening | Rob Legtenberg | MESA+ Institute for Nanotechnology, The Netherlands |
09:45 | EuroNanoLab organization | Vittorio Morandi | EuroNanoLab |
10:00 | Beyond Bosch-based etching, from Bosch to DREM, to DREAM, to CORE, to microCORE - Part 1 | Henri Jansen | DTU, Denmark |
11:00 | Coffee break | ||
11:30 | Beyond Bosch-based etching, from Bosch to DREM, to DREAM, to CORE, to microCORE - Part 2 | Henri Jansen | DTU, Denmark |
13:00 | Lunch buffet | ||
14:00 | The multi-scale etching approach (plasma model, sheath model and surface model) | Ahmed Rhallabi | University of Nantes, France |
16:00 | Coffee break | ||
16:30 | Process Control for III-V compound semiconductors etching using inductively-coupled plasma (ICP) RIE | Tomoya Sugahara | Samco, Japan |
17:10 | Vapour-phase etching (vapour HF and XeF2) at the nanoscale | Tony O'Hara and Toni Sandbrink-Koblenz | Memsstar, United Kingdom |
19:00 | School dinner |
Wednesday - 10th of April
Time | Title | Presenter | Affiliation |
08:30 | Start-up with coffee/tea | ||
09:00 | Deep reactive ion etching of ultralow expansion glasses and glass-ceramics in a fluorine-based plasma (for microsystems applications) | Christoph Weigel | Technische Universität Ilmenau, Institute of Micro- and Nanotechnologies, Germany |
11:00 | Coffee break | ||
11:30 | Etching silicon, dielectrics, low-k materials and ALE with plasma cryogenic | Thomas Tillocher | Gremi, France |
13:00 | Lunch buffet | ||
14:00 | Advanced HDRF technology | Marc Segers | Plasma-Therm, France |
15:30 | Coffee break | ||
15:45 | Flash presentations:
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17:00 | Network, poster, exhibition session with walking dinner |
Thursday - 11th of April
Time | Title | Presenter | Affiliation |
08:30 | Start-up with coffee/tea | ||
09:00 | Exhaust gas treatment solutions for semiconductor processes – focus on etch applications | Jens Baßfeld | CS Clean Solutions |
10:00 | High global warming gases abatement using plasma technology | Hervé Dulphy | Air Liquide |
11:00 | Coffee break | ||
11:30 | Towards carbon neutrality from the perspective of a sub-fab solution provider | Angela Bayler | Centrotherm Clean Solutions |
12:30 | Self-aligned crystallographic fabrication of 3D nanosystems | Niels Tas and Erwin Berenschot | MESA+ Institute for Nanotechnology |
13:30 | Lunch buffet | ||
14:30 | Atomic Layer Etching: trends and applications | Erwin Kessels | TU/e, The Netherlands |
15:30 | Atomic Layer Etching: tool aspects and process examples | Harm Knoops | Oxford Instruments Plasma Technology, United Kindom |
16:30 | Coffee break | ||
17:00 | Some reflections on future plasma etch and clean processes: The UN SDGs and EU F-gas regulation. | Henri Jansen | DTU, Denmark |
18:00 | Free time |
Friday - 12th of April
Time | Title | Presenter | Affiliation |
08:30 | Start-up with coffee/tea | ||
09:00 | Sub-micronic etching using pulsing mode | Maxime Darnon | Hubert Curien Laboratory, France |
10:30 | Coffee break | ||
11:00 | The use of SPC DRIE process | Christiaan Bruinink | MESA+ Institute for Nanotechnology, The Netherlands |
12:30 | Lunch buffet | ||
14:00 | Optional: tour around the MESA+ NanoLab facility (registration for this can be done upon arrival at the registration desk) |