Infrastructure:                                    

  • Analysis Lab, to test functional properties of the devices
  • Fabrication, full processing line for piezoMEMS in the MESA+ NanoLab
  • Modeling and design, simulation of mechanical, electrical, fluidic, acoustic and other properties. Waferscale design
  • System integration, on-chip electronics, ASICs and packaging

Knowledge:    

  • Piezoelectric thin films, novel materials, such as lead-free piezoelectric materials and 
  • Alternative device geometries, for instance free-standing MEMS, additional layers