Facilities and resources

Infrastructure:                                    

• Analysis Lab, to test functional properties of the devices
• Fabrication, full processing line for piezoMEMS in the MESA+ NanoLab
• Modeling and design, simulation of mechanical, electrical, fluidic, acoustic and other properties. Waferscale design
• System integration, on-chip electronics, ASICs and packaging

Knowledge:    

• Piezoelectric thin films, novel materials, such as lead-free piezoelectric materials and 
• Alternative device geometries, for instance free-standing MEMS, additional layers