Key-note presentations will be given by internationally recognised experts from both academia and industry. The topics range from fundamental principles to simulation/modelling of processes, plasma sources, and various applications. The programme is:
TUESDAY - 26TH OF MAY
Time | Title | Presenter | Affiliation |
12:30 | Registration with coffee/tea | ||
CHAIR: Susana Cardoso de Freitas | |||
13:30 | Opening | Susana Cardoso de Freitas | |
13:45 | Cryogenic etching: principles and applications | Thomas Tillocher | |
15:15 | Coffee break | ||
CHAIR: Tiago Filipe da Ponte Silva | |||
15:45 | Plasma etching for photonic and quantum computing applications | Andrei Uvarov | |
16:30 | Advanced plasma etching for photonic integrated circuit (PIC): III–V semiconductor etching, PhC etching, ALE, and Si DRIE technologies | Tomoyuki Nonaka | |
17:15 | Reception and cocktail party |
WEDNESDAY - 27TH OF MAY
Time | Title | Presenter | Affiliation |
08:30 | Start-up with coffee/tea | ||
CHAIR: Thomas Tillocher | |||
09:00 | Decoding low-temperature plasmas: Models, limits, and opportunities | Tiago Silva | |
10:00 | The LisbOn KInetics Global Model: a tool for plasma chemistry studies | Luís Alves | |
10:30 | Coffee break | ||
CHAIR: José Fernandes | |||
11:00 | Process gas analytics for sustainable semiconductor manufacturing: Transforming process insight into operational excellence and environmental accountability | Tobias Hinke | |
11:45 | Oxford Instruments plasma etching: from controlled ALE to low damage InP etch - advanced research and development to high volume manufacturing | Owain Thomas | |
12:30 | Lunch buffet | ||
CHAIR: Luís Lemos Alves | |||
13:45 | Understanding and advancing plasma etch processes | Paul Plate | |
14:30 | Beyond resist removal: Plasma ashing challenges in semiconductor manufacturing | Kyrill Koekenberg | |
15:15 | Coffee break | ||
CHAIR: Henk-Willem Vetkamp | |||
15:45 | Flash presentations by sponsors |
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17:00 | Network, poster, exhibition session with walking dinner |
THURSDAY - 28TH OF MAY
Time | Title | Presenter | Affiliation |
08:30 | Start-up with coffee/tea | ||
CHAIR: Lucia Romano | |||
09:00 | Process development and new approaches for sustainable DRIE | Georg Umlauf | |
10:30 | Coffee break | ||
CHAIR: Kaiying Wang | |||
11:00 | Femtosecond laser an alternative method for dielectric materials etching | Jassem Safioui | |
11:45 | Ion beam processing: From theory to practice | Manuela Lötsch & Erica Warth | |
12:30 | Lunch buffet | ||
CHAIR: Georg Umlauf | |||
13:30 | Catalyst Etching for high aspect ratio nano- and micro-structuring: from wet to gas phase | Lucia Romano | |
14:45 | Gas MacEtch Processing Technology – Hardware and process development for Metal-Assisted Chemical Etching of high aspect ratio silicon structures in the vapour phase | David Anderson | |
15:45 | Coffee break | ||
CHAIR: Djaffar Belharet | |||
16:15 | Etching strategies for integration of nanostructures in non-conventional substrates | José Fernandes | |
17:30 | Closing of day 3 | ||
18:00 | Bus trip to Belém in Lisbon & School dinner at Casa de Desenho |
FRIDAY - 29TH OF MAY
Time | Title | Presenter | Affiliation |
08:30 | Start-up with coffee/tea | ||
CHAIR: Andrei Avram | |||
09:00 | Atomic layer etching: Trends and applications | Erwin Kessels | |
10:30 | Coffee break | ||
CHAIR: Erwin Kessels | |||
11:00 | Black Silicon Micro/Nanofabrication: From Surface Engineering to Applications | Kaiying Wang | |
12:00 | Closing of the event | ||
12:30 | Lunch (served in lunch boxes) | ||
14:00 | Optional: tour around the INESC-MN facility (registration for this can be done upon arrival at the registration desk) |