On the 10th of January, Henk-Willem Veltkamp (NanoLab) was awarded the Publication Award of the Plasma Technologies department of Oxford Instruments plc for his conference paper “High power Si sidewall heaters for fluidic applications fabricated by Trench-Assisted Surface Channel Technology” (https://doi.org/10.1109/MEMSYS.2019.8870667), which was published at the 2019 IEEE Conference on Micro-Electromechanical Systems held in Seoul, South Korea. In this paper, the new and novel Trench-Assisted Surface Channel Technology microfabrication platform is presented. Using this technology, microfluidic channels with embedded robust silicon sidewall heating elements can be fabricated, which can be used in applications like microreactor systems, microcombustors, and high-temperature physical parameter sensing.
On Wednesday the 19th of January, Marc Schellschopp from Oxford Instruments visited the MESA+ NanoLab to hand over the certificate and prize, but also to discuss the work performed and how this is a perfect example of complex fabrication technologies which can be performed in the MESA+ NanoLab, the possibilities of the Trench-Assisted Surface Channel Technology platform, and the used Oxford Instruments equipment, being the PlasmaPro 100 Estrelas silicon etcher, the Plasmalab 80Plus plasma-enhanced chemical vapour deposition, and the Ionfab 300Plus ion beam etcher.
