Full programme

Key-note presentations will be given by internationally recognised experts from both academia and industry. The topics range from fundamental principles to simulation/modelling of processes, plasma sources, and various applications. The programme is:

TUESDAY - 26TH OF MAY

Time

Title

Presenter

Affiliation

12:30

Registration with coffee/tea



13:30

Opening

Susana Cardoso de Freitas

13:45

Cryogenic etching: principles and applications

Thomas Tillocher

15:15

Coffee break



15:45

Plasma etching for photonic and quantum computing applications

Andrei Uvarov

16:30

Advanced plasma etching for photonic integrated circuit (PIC): III–V semiconductor etching, PhC etching, ALE, and Si DRIE technologies

Tomoyuki Nonaka

17:00

Reception and cocktail party



WEDNESDAY - 27TH OF MAY

Time

Title

Presenter

Affiliation

08:30

Start-up with coffee/tea



09:00

Decoding low-temperature plasmas: Models, Limits, and Opportunities

Tiago Silva

10:00

The LisbOn KInetics Global Model: a tool for plasma chemistry studies

Luís Alves

10:30

Coffee break



11:00

Title to be announced

Tobias Hinke

11:45

Title to be announced

To be announced

12:45

Lunch buffet



13:45

Understanding and advancing plasma etch processes

Paul Plate

14:30

Title to be announced

Kyrill Koekenberg

15:15

Coffee break



15:45

Flash presentations by sponsors



17:00

Network, poster, exhibition session with walking dinner



THURSDAY - 28TH OF MAY

Time

Title

Presenter

Affiliation

08:30

Start-up with coffee/tea



09:00

Process development and new approaches for sustainable DRIE

Georg Umlauf

10:30

Coffee break



11:00

Femtosecond laser an alternative mehod for dielectric materials etching

Jassem Safioui

11:45

Ion beam processing: From theory to practice

Manuela Lötsch

12:30

Lunch buffet



13:30

Catalyst Etching for high aspect ratio nano- and micro-structuring: from wet to gas phase

Lucia Romano

14:45

Gas MacEtch Processing Technology – Hardware and process development for Metal-Assisted Chemical Etching of high aspect ratio silicon structures in the vapour phase

David Anderson

15:45

Coffee break



16:15

Etching strategies for integration of nanostructures in non-conventional substrates

José Fernandes

17:30

Closing of day 3



18:00

Bus trip to Belém in Lisbon & School dinner at Casa de Desenho


FRIDAY - 29TH OF MAY

Time

Title

Presenter

 Affiliation

08:30

Start-up with coffee/tea



09:00

Atomic Layer Etching: Trends and Applications

Erwin Kessels

10:30

Coffee break



11:00

Black Silicon Micro/Nanofabrication: From Surface Engineering to Applications

Kaiying Wang

12:00

Closing of the event



12:30

Lunch buffet



14:00

Optional: tour around the INESC-MN facility (registration for this can be done upon arrival at the registration desk)