Monday 27 September, 10:00 – 12:30

Silicon carbide thin-film encapsulation of planar thermo-electric infrared (IR) detectors – for an IR microspectrometer
V. Rajaraman, G. de Graaf, P.J. French, K.A.A. Makinwa and R.F. Wolffenbuttel
Delft University of Technology (TU Delft), Dept. of Microelectronics, EI Lab - DIMES, The Netherlands

Design, fabrication and characterization of an in-plane AFM probe with ultra-sharp silicon nitride tip
E. Sarajlic1, J. Geerlings2, J.W. Berenschot2, M.H. Siekman1,2, N.R. Tas2 and L. Abelmann2
1SmartTip, Enschede, The Netherlands
2MESA+ Research Institute, University of Twente, The Netherlands

A silicon micromachined triaxial accelerometer using the MultiMEMS MPW process with additional deep reactive ion etching as post-processing
P. Ohlckers, L. Petricca and C. Grinde
Vestfold University College, Institute for Micro- and nano System Technologies, Norway

Integrated lab-on-a-chip silicon nanowire biosensing platform
A. De, S. Chen, J. van Nieuwkasteele, W. Sparreboom, E.T. Carlen and A. van den Berg
BIOS Lab on a Chip Group, MESA+ Institute for Nanotechnology, University of Twente, The Netherlands

Surface modification of silicon by 3D etching processes and subsequent layer deposition
Z. Fekete, D. Gubán, É. Vázsonyi, A. Pongrácz, G. Battistig and P. Fürjes
Research Institute of Technical Physics & Materials Science, Hungarian Academy of Science, Hungary

Material selection for impedance spectroscopy on an electrowetting based lab-on-a-chip
T. Lederer, S. Clara, B. Jakoby and W. Hilber
Institute for Microelectronics and Microsensors, Johannes Kepler University, Austria

Stiction reduction in electrostatic poly-SiGe micromirrors by applying a self-assembled monolayer film
L. Fangzhou1,2, J. de Coster1, R. Beernaert3, W.-Y. Lin1,2, J.-P. Celis and I. de Wolf
1IMEC, Belgium
2Dept MTM, KU Leuven, Belgium
3CMST, Ghent Univerity, Belgium

A bridge-connected isolated silicon islands post-processing method for fine-grain-integrated ±10V-operating CMOS-MEMS by standard 5V CMOS process technology
S. Morishita1, M. Kubota1, K. Asada1, I. Mori1, F. Marty2 and Y. Mita1
1The University of Tokyo, Japan
2ESIEE, Université́ Paris Est, France

Single-mask thermal displacement sensor in MEMS
B. Krijnen1,2, R.P. Hogervorst1, J.B.C. Engelen3, J.W. van Dijk1,2, D.M. Brouwer1,2 and L. Abelmann3
1DEMCON Advanced Mechatronics, The Netherlands
2Mechanical Automation, IMPACT, University of Twente, The Netherlands
3Transducer Science and Technology, MESA+, University of Twente, The Netherlands

AlGaN/GaN C-HEMT for piezoelectric MEMS stress sensor applications
M. Vallo1, T. Lalinský1, G. Vanko1, M. Drzík2, S. Hascík1, I. Rýger1 and I. Kostic3
1Institute of Electrical Engineering of the Slovak Academy of Sciences, Slovakia
2International Laser Center, Slovakia
3Institute of Informatics, Slovak Academy of Sciences, Slovakia

A capacitive humidity sensor using a positive photosensitive polymer
N.P. Pham, V. Cherman, F.F.C. Duval, D.S. Tezcan, R. Jansen and H.A.C. Tilmans
IMEC, Belgium

Silicon/glass microchip with a monolithically integrated electrospray ionization tip for mass spectrometry
L. Sainiemi1, T. Nissilä2,3, V. Saarela4, R. A. Ketola3 and S. Franssila1
1Aalto University, Department of Materials Science and Engineering, Finland
2University of Helsinki, Division of Pharmaceutical Chemistry, Finland
3University of Helsinki, Centre for Drug Research (CDR), Finland
4Aalto University, Department of Micro and Nanosciences, Finland

Improving the efficiency of thermoelectric generators by using solar heat concentrators
M.T. de Leon, P. Taatizadeh and M. Kraft
University of Southampton, School of Electronics and Computer Science, United Kingdom

Gas sensing micromachined structure based on gallium arsenide
I. Hotovy1, D. Tengeri1, V. Rehacek1, S. Hascik2 and T. Lalinsky2
1Microelectronics Department, Slovak University of Technology, Slovakia
2Institute of Electrical Engineering, Slovak Academy of Sciences, Slovakia

Structuring techniques of aluminum nitride masks for deep reactive ion etching (DRIE) of silicon
S. Leopold1, T. Polster1, T. Geiling1, D. Pätz2, F. Knöbber4, A. Albrecht3, O. Ambacher4, S. Sinzinger2 and M. Hoffmann1
1Ilmenau University of Technology, IMN MacroNano®, Germany, Department for Micromechanical Systems, 2Department for Optical Engineering, 3Centre for Micro- and Nanotechnology, 4Fraunhofer Institute for Applied Solid State Physics, Germany

Design and evaluation of an active cooling concept for functional ceramic circuits
T. Haas1, C. Zeilmann1, A. Backes2, A. Bittner3 and U. Schmid3
1Engineering Substrate, Micro Systems Engineering GmbH, Germany
2Chair of Micromechanics, Microfluidics/Microactuators, Saarland University, Germany
3Department for Microsystems Technology, Institute of Sensor and Actuator Systems, Vienna University of Technology, Austria

Determination of mechanical and swelling properties of Epoclad negative photoresist
K. Wouters1, P. Gijsenbergh1, K. Vanstreels2 and R. Puers1
1KULeuven, ESAT-MICAS, Belgium
2IMEC, Belgium

Graphene for nano-electro-mechanical systems
Z. Moktadir, S. Boden, H. Mizuta and H. Rutt
University of Southampton, School of Electronics and Computer Science, UK

Inductive-coupling system for abdominal aortic aneurysms monitoring based on pressure sensing
A.T. Sepúlveda1, A. Moreira2, F. Fachin3, B.L. Wardle3, J.M. Silva4, A.J. Pontes1, J.C. Viana1 and L.A. Rocha1
1I3N/IPC-Institute for Nanostructures, Nanomodelling and Nanofabrication, University of Minho, Portugal
2University of Porto – Faculty of Engineering, Portugal
3Department of Aeronautics and Astronautics, Massachusetts Institute of Technology, USA
4INESC Porto, University of Porto – Faculty of Engineering, Portugal