The Analysis Group offers facilities for specimen preparation and a range of advanced instruments to perform surface- and bulk analysis on a variety of materials. From large format saws to small format dimple grinders, there are possibilities to create specimen that can be analysed. Cutting, (vacuum)casting, grinding, polishing, cleaning, control, coating are amongst the techniques we offer to make the best possible shapes for analysis.
Leica EM CPD 300
With a critical point dryer it is possible to dry water containing specimen in a way that they shrink almost conformal.
Advanced plasma cleaning system for removal of hydrocarbon contamination on TEM and SEM samples. Cleaning small specimen for TEM or SEM use by a low energy H2 / O2 plasma
Used to decrease the thickness of thin TEM samples. A mechanical wheel grind the thin specimen to a thickness of less than 1 um. After the use of this instrument, the ultimate thinning of the TEM specimen takes place in the precision ion polishing system
This wide field microscope is used to control specimen during the grinding and polishing proces.
Optical microscope with zoom objective lens 6.7 - 40x for sample inspection purposes. A ring light Olympus highlight 3100 accompanies the microscope objective. Used to view rather large specimen.
Macroscope for high-precision work in inspection and measurement , equipped with a camera.
Struers Labotom 3 rough cutting saw
Saw to cut small pieces out of a big piece of material. Metals of a thickness of 1 - 2 cm can be cut into smaller pieces. The smaller pieces can be cut again into even smaller pieces and if small enough they can be pressed into a sample that fits a SEM
Buehler Isomet low speed saw
Used to slice down bigger pieces of materials to quite small ones that can be used to make TEM specimen.
Small pieces of material that need to be grinded and polished can be pressed into conducting bakelite material of a size that is suitable to handle in the grinder/polisher equipment.The product wll have diameter of 1" and a height of 2-3 cm.
BUEHLER ECOMET 3
Buehler Phoenix Beta
variable speed grinder polisher
Double grinder, single speed, 250 rpm, for manual preparation of materialographic specimens.
grinder-polisher for ultimate flatness and smoothness of SEM samples
Double grinder-polisher for grinding samples with sandpaper or carbide paper
Biorad Polaron Division E6
Gold / Carbon coater for the coverage of non conducting SEM specimen with a thin layer of conducting material. The sample size can be of the order of 5x5x5 cm.
Precision Etching and Coating System. This system is used to etch or slope cut a specimen. Just like a cut that is possible with a FIB. Only this cut will be have sample size width. After cutting or stand alone a coating can be applied to the sample. Carbon / Chromium can be deposited on the samples with controlled layer thickness, down to Angstrom size. Includes a Film Thickness Monitor for accurate control of film thickness
The sample size can be around 1x1x1 cm.
For the cleaning of specimen or small instruments.The cleaner uses ultrasonic energy (40 kHz) in the form of sound waves to create millions of tiny microscopic bubbles in the solution that even works its way into holes and hidden cavities, loosening dirt on all surfaces that the solution touches. These actions, called cavitation occurs thousands of times per second to gently yet thoroughly scrub contaminations off the article being cleaned. When you lift the item out of the cleaner, it’s microscopically clean.