As chips get smaller and more powerful, overheating has become one of the biggest barriers to innovation in electronics. A Dutch research team has now developed a breakthrough 3D printing (additive manufacturing) solution to tackle this heat challenge, earning them the prestigious Thematic Technology Transfer Proof of Concept (TTT-PoC) Award.
The award-winning technology enables far more efficient cooling in advanced microelectronics, paving the way for more powerful devices that use less energy.
The ongoing miniaturisation of semiconductors enables the integration of more functionality into smaller components. However, this also increases heat generation, threatening the reliability and lifespan of microelectronics. Improving energy efficiency alone is not enough; advanced thermal management has become essential to enable the next generation of innovation.
The TTT-PoC program recognised this challenge by awarding the team’s breakthrough in additive manufacturing for advanced microelectronic cooling. This approach addresses thermal management, the critical bottleneck in delivering more power in smaller packages while minimising the energy required for cooling.
The research team, led by Dr. S. Dehgahi and supported by Dr. Jafari and Federico van Eijnatten, brings deep expertise in powder metallurgy, computational thermodynamics, and additive manufacturing.
The team will validate the technology across the entire value chain, working closely with designers and manufacturers at the die, package, and system levels. This chain-wide approach will help identify the most impactful applications and maximise benefits for the microelectronics industry.
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