Facilities

Modern data infrastructure relies on moving high bandwidth data over optical fiber. Existing solutions are often designed for a specific applications, resulting in complex, bulky and energy-intensive hardware.

Sabratha is developing a universal photonic solution for these data connections. Our photonic chip technology converts electrical signals into light and allows for optical signal processing on the same chip platform. At its core is thin-film lithium niobate (TFLN), an emerging photonic material that combines high-speed electro-optic modulation with compact integrated devices. By combining broadband TFLN modulators with tunable Brillouin photonic filters, our platform is designed to operate across a broad range of frequencies and applications, from telecommunications and satellite communications to datacenters and defense.

Sabratha was founded in November 2025 as a spin-off from the University of Twente. Since then, we have grown into a team of seven, bringing together expertise in photonics, RF engineering, nanofabrication and product development. We develop and fabricate our TFLN photonic chips using advanced cleanroom infrastructure, including the MESA+ NanoLab.

After 15 years of loyal service, the Zeis Merlin high-resolution SEM in the Analysis Labs of MESA+ will get a successor. 

In the presentation we will briefly address the capabilities of the new HR-SEM and highlight some aspects in more depth, such as the reason for inclusion of 2 EDS detectors, variable pressure SEM and SEM-Raman.

The fabrication of photonic integrated circuits requires accurate translation of complex layouts into reproducible physical structures. This depends not only on the performance of individual fabrication steps, but also on how effectively layout preparation, lithography, etching and process verification are connected. This presentation provides an overview of selected activities of the PhotonDelta Nanolab Team focused on improving photonic fabrication technology. The work includes the development of a unified layout preparation workflow using the MESA+ Process Design Kit, the evaluation and optimization of electron-beam lithography strategies, and design-for-fabrication approaches targeting improved process uniformity across the substrate.

Fabricated structures are assessed using cross-sectional characterization, with particular attention given to the transfer of target geometries and critical dimensions. Current activities investigating further lithographic improvements and their impact on the overall fabrication result will also be discussed. Finally, emerging post-processing approaches will be introduced as an ongoing research direction.

Across Europe, national governments, and regional innovation ecosystems, major initiatives are strengthening semiconductor R&D and manufacturing through the development of advanced pilot lines. The central challenge, however, is no longer invention alone—it is translating innovation into industrial-scale impact by connecting technologies, infrastructure, knowledge, and industry within an integrated ecosystem.

Integrated photonics has emerged as a key enabling technology in response to rapidly evolving semiconductor and digital technology markets. With a strong research and industrial ecosystem, the Twente region is exceptionally well positioned to play an international role in this field.

Supported by European and national funding programmes, including PIXEurope, the University of Twente is establishing a 200 mm pilot line for the fabrication of silicon nitride (Si₃N₄) and aluminium oxide (Al₂O₃) photonic integrated circuits (PICs). The pilot line will bridge the gap between laboratory-scale innovation and scalable manufacturing, providing an open platform for technology development, process integration, and industrial adoption.

A key focus will be the development of advanced processes and process design kits (PDKs) enabling ultra-low-loss waveguides and highly efficient, low-power modulation. This will include the monolithic integration of piezoelectric and electro-optic materials—including PZT, AlScN, and BaTiO₃—to enable stress-optical and electro-optical modulation.

By combining advanced materials, scalable 200 mm processing, robust PDKs, and a collaborative ecosystem, the initiative aims to accelerate the transition of integrated photonics from innovative concepts to manufacturable technologies.