•R.H.W. ten Thije, R. Akkerman, A multi-layer triangular membrane finite element for the forming simulation of laminated composites, Composites Part A: Applied Science and Manufacturing, Vol.40, Issue 6-7, 2009, p. 739-753.
•H.A. Visser, L.L. Warnet, R. Akkerman, An attempt to use scratch tests to predict the residual lifetime of unplasticised poly(vinyl chloride) pipes, Engineering Fracture Mechanics, Vol. 76, Issue 18, 2009, p. 2698-2710.
•H.P. de Bruijn, R.H.W. ten Thije, S Johannes, Mastopexy with mesh reinforcement: the mechanical characteristics of polyester mesh in the female breast, Plastic and Reconstructive Surgery, Vol. 124, Issue 2, 2009, p. 364-371.
•M. Zeinstra, R.H.W. ten Thije, L.L. Warnet. Low velocity impact on a single-ply aramid semipreg, International Journal of Material Forming, Vol. 2, Supp. 1, 2009, p. 193-196.
•R.H.W. ten Thije, R. Akkerman, Design of an experimental setup to measure tool-ply and ply-ply friction in thermoplastic laminates, International Journal of Material Forming, Vol. 2, Supp. 1, 2009, p. 197-200.
•W.J.B. Grouve, R. Akkerman, Multi-scale effects in the consolidation of thermoplastic laminates, International Journal of Material Forming, Vol. 2, Supp. 1, 2009, p. 157-160.
•A. Sridhar, J. Reiding, H. Adelaar, F. Achterhoek, D. J. van Dijk, R. Akkerman, Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substrates, Journal of Micromechanics and Microengineering, Vol. 19 (8), 2009, art. no. 085020.
•A. Sridhar, D.J. van Dijk, R. Akkerman, Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material, Thin Solid Films, Vol. 517 (16), 2009, pp. 4633-4637.
•A. Sridhar, M. A. Perik, J. Reiding, D. J. van Dijk and R. Akkerman, Fabrication of RF Circuit Structures on a PCB Material Using Inkjet Printing-Electroless Plating and the Substrate Preparation for the Same, Transactions of The Japan Institute of Electronics Packaging, Vol. 2 (1), 2009.
•H.A. Visser, T.C. Bor, M. Wolters, L.E. Govaert, The influence of physical ageing on yielding and failure of unplasticised poly(vinyl chloride) pipes, Proceedings of DYFP, Rolduc Kerkrade, the Netherlands, 2009.
•B.Cornelissen, R. Akkerman, Analysis of yarn bending behaviour, 17th International Conference on Composite Materials (ICCM 17), Conference Proceedings, Edinburgh, Scotland, 2009.
•W.J.B. Grouve, R. Akkerman, A consolidation process model for film-stacking glass/PPS laminates, 17th International Conference on Composite Materials (ICCM 17), Conference Proceedings, Edinburgh, Scotland, 2009.
•S.P. Haanappel, R. Akkerman, Assessment of joining methods for thermoplastic composites, 15th International Conference on Composite Structures, Porto, Portugal, June 15-17, 2009.
•A. Sridhar, D.J. van Dijk, R. Akkerman, A comparative study of two conductive inkjet inks for fabrication of RF circuit structures, Proceedings of LOPE-C, Frankfurt, Germany, June 23-25, 2009.
•A. Sridhar, D.J. van Dijk, R. Akkerman, Substrate modification of a PCB substrate for better adhesion of inkjet printed circuit structures, Proceedings of ‘Printing Future Days 2009’, Chemnitz, Germany, November 02-05, 2009.