1 feb 2012 - New Atomic Layer Deposiition cluster tool

ALD – Winner technology for thin films

The MESA+ Institute for Nanotechnology invested in a new Atomic Layer Deposition (ALD) cluster tool from the company PICOSUN, a cluster tool with an integration platform for 100 mm up to 200 mm wafers. Connected to the integration platform is one PEALD reactor, one thermal ALD reactor and manual load lock system.

As a surface controlled, self-limiting chemical vapor processing method, ALD ensures 100% uniform, conformal, defect and pinhole free thin growth. The tool will be used for dielectric layers (High K), passivation and diffusion barriers, seed layers, conductive layers and alternated layers.